CES 2025 is less than a month away and leaks about AMD Strix Halo APUs are starting to emerge. Today we have confirmation via a leaked Geekbench Vulcan test that AMD will launch the Ryzen AI MAX+ PRO 395 w/ Radeon 8060S "Strix Halo" APU. Information reveals that this APU is equipped with 16 Zen 5 cores with 32 threads, a 3 GHz base frequency (4.4 GHz max), and a boost up to 5.1 GHz. It sports a 32 MB L3 cache per CCD for a total of 64 MB since it uses a dual CCD chip design. The TDP should be between 55-130 W. Moreover, the "PRO" in the product naming suggests that AMD could release non-PRO models at a later date.

The integrated Radeon 8060S iGPU adopts the RDNA 3.5 architecture with 40 computing units and was tested using an AMD reference board design codenamed AMD MAPLE-STXH and 64 GB of memory scoring 67,004 points in the Geekbench Vulkan test. This initial result is lower than AMD Radeon RX 7600 RDNA 3 discrete entry-level products (despite having more cores 40CU vs 32CU), and higher than NVIDIA GeForce RTX 3050. However, since the benchmark was run on an evaluation platform without optimized drivers and more likely using an early test sample product, we can expect the actual performance of the Radeon 8060S iGPU to be higher.

HWiNFO has been updated to version v8.16, which brings several new improvements and fixes, as well as adds enhanced support for next-generation AMD CPUs and APUs, as well as next-generation Intel GPUs. While it does not specify any models, it is clear that it gets support for AMD's upcoming Kraken Point and Strix Halo APUs, as well as Intel's upcoming Battlemage GPUs.

In addition, the new HWiNFO v8.16 also improves support for Intel Lunar Lake, adds reporting of number of NPU tiles, adds support for Cybenetics Powenetics PMD (Power Measurements Device), enhances sensor monitoring on MSI's Z890, B860, and H810 series motherboards, enhances reporting of CUDIMM CKD parameters, NGU clock, and drive letter, and improves reporting of V/F curve settings, among other things. You can check out the full release notes below.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

Apple's much awaited M4-based Mac Mini is finally here. As previously indicated by analysts, the Mac mini has received a massive redesign - its first in over a decade. With an amazingly compact chassis that is significantly smaller than before, the Mac mini boasts impressive computing horsepower thanks to the M4 and M4 Pro chipsets, now starting with 16 GB of unified memory.

We are already quite familiar with the M4, which made its debut in the OLED iPad Pro last May. However, the M4 Pro is all-new, boasting up to a 14-core CPU with 10 P-cores and 4 E-cores along with up to a 20-core GPU. The standard M4 packs only 4 P-cores by comparison, and manages to quash Intel's Core Ultra 9 288V in synthetic benchmarks by as much as 60% while trading blows with AMD's Strix Point APUs. The M4 Pro features more than twice the number of P-cores, making it a suitable competitor for Intel's upcoming Arrow Lake-H lineup as well as AMD's Strix Halo.

In case you missed it, AMD's new madcap enthusiast silicon engineering effort, the "Strix Halo," is real, and comes with the Ryzen AI Max 300 series branding. These are chiplet-based mobile processors with one or two "Zen 5" CCDs—same ones found in "Granite Ridge" desktop processors—paired with a large SoC die that has an oversized iGPU. This arrangement lets AMD give the processor up to 16 full-sized "Zen 5" CPU cores, and an iGPU with as many as 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5/x memory interface for UMA.

"Strix Halo" is designed for ultraportable gaming notebooks or mobile workstations where low PCB footprint is of the essence, and discrete GPU is not an option. For enthusiast gaming notebooks with discrete GPUs, AMD is designing the "Fire Range" processor, which is essentially a mobile BGA version of "Granite Ridge," and a successor to the Ryzen 7045 series "Dragon Range." The Ryzen AI Max series has three models based on CPU and iGPU CU counts—the Ryzen AI Max 395+ (16-core/32-thread with 40 CU), the Ryzen AI Max 390 (12-core/24-thread with 40 CU), and the Ryzen AI Max 385 (8-core/16-thread, 32 CU). An alleged Ryzen AI Max 390 engineering sample surfaced on the Geekbench AI benchmark online database.

The upcoming Strix Point Halo processors from AMD now have a new name - Ryzen AI Max - and come with big promises of impressive power. This rumor, first reported by VideoCardz and originating from Weibo leaker Golden Pig Upgrade, reveals key details about the first three processors in this lineup, along with their specifications.

The leaker claims AMD might roll out a new naming system for these processors branding them as part of the Ryzen AI Max series. These chips will run on the anticipated Strix Halo APU. This series includes three models, with the top-end version boasting up to 16 Zen 5 cores and 40 Compute Units (CUs) for graphics. This setup is expected for the best model contrary to earlier rumors that AMD would drop such a variant. In fact, word has it that at least two of the models in this lineup will come with 40 RDNA 3.5 Compute Units. The leaker also hints that Strix Halo will handle up to 96 GB of video memory suggesting AMD aims to make this processor work with its ROCm (Open Compute Platform) system.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

AMD "Strix Halo" isn't just a mobile processor with an oversized iGPU meant to power "gaming ultraportables," it has other potential applications such as game consoles (both handheld and standalone). Not willing to cede this market to AMD, Intel is reportedly readying its own such chip, which is being reported as the "Arrow Lake Halo" for the lack of an official name. This chip will feature a large iGPU based on the Xe2 "Battlemage" graphics architecture, the variant of Xe2 Intel plans to use for its next-generation Arc discrete GPUs. The CPU compute complex will be carried over from the regular "Arrow Lake" chips, and feature a mix of "Lion Cove" P-cores, and "Skymont" E-core clusters.

To meet the higher memory bandwidth demand that arises from a high-performance iGPU and CPU, AMD designed the RDNA 3.5 graphics architecture to be more LPDDR5-aware, since at the physical layer, LPDDR operates differently from GDDR. Intel will probably do something similar, and deploy a 256-bit wide LPDDR5/x memory interface replacing the 128-bit wide interface the regular "Arrow Lake" mobile chips come with. Whether "Arrow Lake Halo" and "Strix Halo" remain competitive will depend a lot on which gaming experiences the two companies want to sell. The way the iGPU of "Strix Halo" is rumored to be specced suggests something that is 1440p-capable, or 4K-capable with FSR 3.

ASUS is betting bigger on game consoles or PCs built like consoles. The company in 2023 introduced the first ROG Z13 Flow, a gaming-grade tablet, powered by a 13th Gen Core "Raptor Lake" processor and mid-tier RTX 40-series "Ada" discrete mobile GPU. The 2025 ROG Z13 Flow is a 13-inch, 16:10 tablet with an integrated kickstand. You can use it like a handheld with touch controls, or place it on a surface and use conventional gaming peripherals, such as keyboard+mouse, or a game controller. Since the device is meant to provide a AAA gaming experience, it packs some serious kit.

Apparently, the 2025 ASUS ROG Z13 Flow will implement AMD's upcoming "Strix Halo" processor that packs up to 16 "Zen 5" CPU cores, and an oversized iGPU with 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5 memory interface, besides a 50 TOPS-class NPU to qualify for Copilot+ AI PC rating. Such a chip would meet the hardware goals of the ROG Z13 Flow, and eliminate the need for a discrete GPU, letting ASUS reduce the mainboard size. The power management of "Strix Halo" would see the CPU and SoC given a roughly 30 W budget, and the iGPU roughly 80 W. Its cooling solution focuses squarely on the "Strix Halo" chip, with no other major chip on the device (the SoC is wired out to serve all chipset functions, no FCH needed).

AMD's upcoming "Strix Halo" mobile processor that features up to 16 "Zen 5" CPU cores and a powerful iGPU with 40 compute units, is beginning to surface in online benchmark databases. We've gone into the juicy technical bits about the processor in our older articles, but put simply, it is a powerful mobile processor meant to square off against the likes of the Apple M3 Pro and M3 Max. A chiplet-based processor, much like the upcoming "Granite Ridge" desktop processor and "Fire Range" mobile processor, "Strix Halo" features up to 16 full-sized "Zen 5" cores, as it uses up to two of the same "Eldora" CCDs as them; but wired to a large I/O die that contains the oversized iGPU, and an NPU, besides the memory controllers. The iGPU has 40 compute units (2,560 stream processors), and is based on the RDNA 3.5 graphics architecture, while the NPU is the same 50 TOPS-class unit carried over from "Strix Point."

A prototype HP laptop powered by a "Strix Halo" processor that uses a single 8-core "Zen 5" CCD, was spied on the web. This chip has eight full-sized "Zen 5" cores that share a 32 MB L3 cache. The iGPU on the I/O die has its own 32 MB Infinity Cache memory that cushions memory transfers. In our older reports, we speculated as to what the memory interface of "Strix Halo" would be. It turns out that the chip exclusively features a 256-bit wide LPDDR5X memory interface, which is double the bus width of "Strix Point." This is essentially what a "quad-channel DDR5" memory interface would be, and AMD is using a memory speed standard of at least LPDDR5X-8000. From the machine's point of view, this would be just a couple of hardwired LPDDR5X chips, or a pair of LPCAMM 2 modules. Back to the benchmarks, and we are shown a single-thread CPU score of 2099 to 2177 points, and a multithreaded score ranging between 5477 points to 13993 points. The laptop was tested with an unknown version and distribution of Linux. The CPU cores are shown boosting up to 5.35 GHz.

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

AMD is rumored to be discontinuing driver support for the Windows 10 operating system for its next-generation mobile processors, starting with the upcoming Ryzen 9000 "Strix Point" (and possibly "Strix Halo" and other chips from the generation). This would mean a lack of official drivers for the XDNA 2 NPU, SoC components, and possibly even the iGPU. This who know their way around manual driver installation might have some luck getting the Windows 11 drivers to work on Windows 10, but for the most part, notebooks and pre-built SFF desktops powered by these chips will not come with Windows 10 preinstalled, since there won't be any official drivers from AMD.

The CPU of Ryzen 9000 "Strix Point" processors should still very much work with Windows 10. This however doesn't cover the upcoming Ryzen 9000 "Granite Ridge" desktop processors, which have minimal hardware that need drivers, except for the basic iGPU they pack. Microsoft is discontinuing Windows 10 from regular updates on October 14, 2025. Those who want to hold on to the operating system need to pay for extended security update plans that get progressively pricier with each year.

AMD's next-generation Ryzen 9000 "Strix Point" mobile processor, which succeeds the current Ryzen 8040 "Hawk Point" and Ryzen 7040 "Phoenix," is confirmed to feature a CPU core-configuration of 12-core/24-thread, according to a specs-leak by HKEPC citing sources among notebook OEMs. It appears like Computex 2024 will be big for AMD, with the company preparing next-gen processor announcements across the desktop and notebook lines. Both the "Strix Point" mobile processor and "Granite Ridge" desktop processor debut the company's next "Zen 5" microarchitecture.

Perhaps the biggest takeaway from "Zen 5" is that AMD has increased the number of CPU cores per CCX from 8 in "Zen 3" and "Zen 4," to 12 in "Zen 5." While this doesn't affect the core-counts of its CCD chiplets (which are still expected to be 8-core), the "Strix Point" processor appears to use one giant CCX with 12 cores. Each of the "Zen 5" cores has a 1 MB dedicated L2 cache, while the 12 cores share a 24 MB L3 cache. The 12-core/24-thread CPU, besides the generational IPC gains introduced by "Zen 5," marks a 50% increase in CPU muscle over "Hawk Point." It's not just the CPU complex, even the iGPU sees a hardware update.

Enthusiasts on the ChipHell forum scored an alleged image of AMD's upcoming "Strix Halo" mobile processor, and set out to create some highly plausible schematic slides. These are speculative. While "Strix Point" is the mobile processor that succeeds the current "Hawk Point" and "Phoenix" processors; "Strix Halo" is in a category of its own—to offer gaming experiences comparable to discrete GPUs in the ultraportable form-factor where powerful discrete GPUs are generally not possible. "Strix Halo" also goes head on against Apple's M3 Max and M3 Pro processors powering the latest crop of MacBook Pros. It has the same advantages as a single-chip solution, as the M3 Max.

The "Strix Halo" silicon is a chiplet-based processor, although very different from "Fire Range". The "Fire Range" processor is essentially a BGA version of the desktop "Granite Ridge" processor—it's the same combination of one or two "Zen 5" CCDs that talk to a client I/O die, and is meant for performance-thru-enthusiast segment notebooks. "Strix Halo," on the other hand, use the same one or two "Zen 5" CCDs, but with a large SoC die featuring an oversized iGPU, and 256-bit LPDDR5X memory controllers not found on the cIOD. This is key to what AMD is trying to achieve—CPU and graphics performance in the league of the M3 Pro and M3 Max at comparable PCB and power footprints.

Two of AMD's upcoming mobile processors that implement the "Zen 5" microarchitecture, "Strix Point" and "Fire Range," were spotted in shipping manifests. These are prototypes moving between AMD and its OEM partners. The manifest explicitly mentions a "Fire Range" 16-core processor sample with 55 W TDP, another "Fire Range" chip with an 8-core configuration and the same 55 W power; and a trio of "Strix Point" processors with a 28 W power design. Two of these are Ryzen 9 SKUs, and one of them is a Ryzen 7.

VideoCardz has the OPN codes for the samples being moved. The Ryzen 7 "Strix Point" sample bears 100-0000001335. One of the two Ryzen 9 "Strix Point" chips bears 100-000000994. The 16-core "Fire Range" is marked 100-000001028, while the 8-core "Fire Range" is 100-000001029. "Strix Point" will be AMD's most imporant mobile processor silicon, as this will be the one with a "Zen 5" CPU core count relevant to the notebook market, pack an RDNA 3+ iGPU, and that alleged 40 TOPS+ XDNA 2 NPU that can run Microsoft Copilot locally. A step up from this will be "Strix Halo," with a higher CPU core count, a much larger iGPU designed for performance-segment gaming. "Fire Range" is essentially a low Z-height BGA version of the "Granite Ridge" chiplet processor that has up to two "Zen 5" CCDs and an I/O die.

AMD Linux engineers have been working on "GFX1150" and "GFX1151" targets for a while—official references to "Strix 1/Strix Point" and "Strix Point Halo" have appeared several times on official development channels. Phoronix's head honcho—Michael Larabel—monitors these activities with keen interest, his latest finding indicates that Team Red is preparing open-source RadeonSI/RADV driver support for the GFX1151 IP. Their MESA 24.1 update merges in GPU enablement for possible high-end "Strix Point Halo" laptop processors—tech tipsters believe that these chiplet variants could sport up to sixteen Zen 5 CPU cores and forty RDNA 3.5 GPU cores.

AMD's enablement of the "GFX1150/Strix Point" GPU appeared online late last month—these monolithic laptop chips are alleged to sit below "Strix Point Halo" in Team Red's product hierarchy. Insiders suggest that the best configurations could house twelve Zen 5 CPU cores and sixteen RDNA 3.5 GPU cores. Phoronix posited that the "RDNA 3 refresh" graphics solution: "is just rumored for select APUs, while ultimately we'll see where this GFX 11.5.1 IP is found if for some further upgraded APU or something more special. In any event the open-source Linux driver support is coming together." According to official product roadmaps, the initial batch of "Strix Point" mobile chips are expected ship later this year—representing a proper next-gen upgrade over current "Hawk Point" offerings.

AMD's next generation Ryzen mobile processor family is undergoing a significant re-positioning of IP within its product stack, as the company introduces the new "elite experience" segment. The "Fire Range" mobile processor is a direct successor to "Dragon Range" MCM, with two 8-core "Zen 5" chiplets. It is essentially a BGA package of the desktop "Granite Ridge" processor, and comes with up to 16 "Zen 5" cores, for flagship gaming notebooks and mobile workstations. A segment below the current "Dragon Range" is the current "Hawk Point" silicon, driving premium experiences. There is a rather large CPU performance gap between the two, as would be the case between the upcoming "Fire Range" and "Kraken Point," which is why AMD is creating the "elite experience" segment, and filling it with "Strix Halo" and "Strix Point," which will square off against Core Ultra 7 and Core Ultra 9 processors, as well as certain HX-segment 14th Gen Core mobile processors. "Strix Point" has a significant core-count increase to 12, along with a large iGPU. We've extensively covered "Strix Point" in our older article, but now we have more information on the elusive "Kraken Point."

"Kraken Point" is codename for AMD's next-generation monolithic mobile processor silicon being designed to power Ryzen processor SKUs competing against the bulk of Intel Core Ultra 5 and Core Ultra 7 SKUs. This chip will be built on a refined 4 nm EUV node by TSMC, and will be monolithic. Its most interesting aspect is the CPU complex. It reportedly features a combination of four regular "Zen 5" cores, and four "Zen 5c" low power cores. All eight cores will likely share a single CCX, which means they share a common L3 cache, which enables easy movement of threads between the two kinds of cores, without having to make round-trips to the DRAM.

References to GFX1150 & GFX1151 targets have been spotted again—this time in a ROCm Github repository—by renowned hardware sleuth; Kepler_L2. These references were first spotted last summer, in an AMDGPU LLVM backend/compiler (reported by Phoronix)—industry experts immediately linked these target codes to next generation "Strix" APU families. The latest leak provides confirmation that the GFX1150 ID is tied to "Strix Point 1," while GFX1151 is an internal IP for "Strix Point Halo," or simply "Strix Halo." The freshly published ROCm Github's commit is titled: "Strix Halo Support and Strix support in staging," which corroborates previous rumors regarding Team Red's engineers being deep into development of Zen 5 (and RDNA 3.5)-based accelerated processing units.

AMD has published several processor product roadmaps with references to "Strix Point" next-gen APUs, with a targeted 2024 launch window. Their December 2023 "Advancing AI Event" confirmed that the "Strix Point" mobile family will sport "XDNA 2" NPUs—previous generation "Phoenix" and recently released "Hawk Point" processors are on the first iteration of XDNA (a spatial dataflow NPU architecture). It is speculated that a typical "Strix Point" laptop processor will pack 12 Zen 5 CPU cores and 16 RDNA 3.5 GPU cores. Team Red has kept quiet about "Strix Halo" (also known as "Sarlak") when conducting public-facing presentations—a loose 2025 launch window is being touted by the rumor mill. The most advanced examples could feature up to 16 Zen 5 CPU cores and 40 RDNA 3.5 GPU cores.

With Windows 11 23H2 setting the stage for increased prevalence of AI in client PC use cases, the new hardware battleground between AMD and its rivals Intel, Apple, and Qualcomm, will be in equipping their mobile processors with sufficient AI acceleration performance. AMD already introduced accelerated AI with the current "Phoenix" processor that debuts Ryzen AI, and its Xilinx XDNA hardware backend that provides a performance of up to 16 TOPS. This will see a 2-3 fold increase with the company's 2024-25 mobile processor lineup, according to a roadmap leak by "Moore's Law is Dead."

At the very top of the pile, in a product segment called "ultimate compute," which consists of large gaming notebooks, mobile workstations, and desktop-replacements; the company's current Ryzen 7045 "Dragon Range" processor will continue throughout 2024. Essentially a non-socketed version of the desktop "Raphael" MCM, "Dragon Range" features up to two 5 nm "Zen 4" CCDs for up to 16 cores, and a 6 nm cIOD. This processor lacks any form of AI acceleration. In 2025, the processor will be succeeded with "Fire Range," a similar non-socketed, mobile-friendly MCM that's derived from "Granite Ridge," with up to two 4 nm "Zen 5" CCDs for up to 16 cores; and the 6 nm cIOD. What's interesting to note here, is that the quasi-roadmap makes no mention of AI acceleration for "Fire Range," which means "Granite Ridge" could miss out on Ryzen AI acceleration from the processor. Modern discrete GPUs from both NVIDIA and AMD support AI accelerators, so this must have been AMD's consideration to exclude an XDNA-based Ryzen AI accelerator on "Fire Range" and "Granite Ridge."